Université Laval

Published purpose

The progress in silicon photonics research has seen the advent of photonic sensors as a promising technology for its low-cost, small size and robustness. Photonic integrated circuits offer compact and all-in-one optical assembly on a chip the size of a few hundred micrometers and make it an ideal target for portable solutions for use in the field. Conventional light-to-chip coupling is achieved through the use of optical fibers precisely aligned to surface grating couplers on-chip. For a portable, self-contained unit, the delicate hardware must be secured with adhesives and solders that cause mechanical stresses in the chip, leading to false sensor readings and degradation with exposure to the harsh environment of the field. Furthermore, it is often required to place sensors in difficult to reach places. This project, will design and characterize novel nanophotonic structures on a silicon chip capable of receiving and transmitting a collimated beam of light for remote, free-space sensing. This will allow placing the sensor device in otherwise difficult to reach locations and remotely interrogate the chip by illuminating its surface with a beam of light.